On September 18th, Xu Zhijun, Vice Chairman and Rotating Chairman of Huawei, stated in a speech that Huawei has planned multiple Ascend chips for the next three years, including 950PR, 950DT, Ascend 960, and 970. Among them, 950PR will be launched to the public in the first quarter of 2026, and the chip adopts Huawei's self-developed HBM. In addition, he stated that supernodes have become the new normal for AI infrastructure construction, and currently Cloud Matrix 384 supernodes have deployed over 300 sets.
It is worth noting that at the end of the speech, Xu Zhijun stated, "Due to the sanctions imposed by the United States, we are unable to invest in TSMC chips, and our computing power per chip is inferior to that of Nvidia. However, Huawei has accumulated over 30 years of experience in connecting people and machines, so we have invested heavily in and achieved breakthroughs in connectivity technology, enabling us to achieve super nodes at the level of tens of thousands of cards, and thus always be able to achieve the strongest computing power in the world!" Xu Zhijun pointed out that Huawei is willing to continue to work with the industry to build a solid foundation to support the demand for AI computing power in China and even the world.
